Invention Grant
- Patent Title: Wave soldering bath
- Patent Title (中): 波峰焊浴
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Application No.: US11886006Application Date: 2006-03-07
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Publication No.: US07988030B2Publication Date: 2011-08-02
- Inventor: Mitsuo Zen , Hirokazu Ichikawa
- Applicant: Mitsuo Zen , Hirokazu Ichikawa
- Applicant Address: JP Tokyo
- Assignee: Senju Metal Industry Co., Ltd.
- Current Assignee: Senju Metal Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agent Michael Tobias
- Priority: JP2005-078457 20050318
- International Application: PCT/JP2006/304328 WO 20060307
- International Announcement: WO2006/100899 WO 20060928
- Main IPC: B23K1/08
- IPC: B23K1/08

Abstract:
In a conventional wave soldering bath, the bottom surface of a bath body in a position which is below the inlet of a duct underwent erosion by molten solder and had a hole formed therein, causing molten solder to be spilled out from the hole. The cause of erosion of the bottom surface of the bath body is a vortex (T) of molten solder formed below the duct inlet accompanying rotation of an impeller pump (10), and the vortex rubs the bottom surface of the bath body.In the present invention, a shielding member (14) is installed between the duct inlet (12) and the bottom surface (13) of the bath body such that the vortex is prevented from affecting the bottom surface.
Public/Granted literature
- US20090050674A1 Wave Soldering Bath Public/Granted day:2009-02-26
Information query
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