Invention Grant
US07987888B2 Releasing method and releasing apparatus of work having adhesive tape
失效
具有粘合带的工作的释放方法和释放装置
- Patent Title: Releasing method and releasing apparatus of work having adhesive tape
- Patent Title (中): 具有粘合带的工作的释放方法和释放装置
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Application No.: US12134807Application Date: 2008-06-06
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Publication No.: US07987888B2Publication Date: 2011-08-02
- Inventor: Masayuki Yamamoto , Yasuji Kaneshima
- Applicant: Masayuki Yamamoto , Yasuji Kaneshima
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Cheng Law Group, PLLC
- Priority: JP2003-340757 20030930
- Main IPC: B32B38/10
- IPC: B32B38/10 ; B25B11/00
Abstract:
In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape.
Public/Granted literature
- US20080230183A1 RELEASING METHOD AND RELEASING APPARATUS OF WORK HAVING ADHESIVE TAPE Public/Granted day:2008-09-25
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