Invention Grant
- Patent Title: Method of forming solid vias in a printed circuit board
- Patent Title (中): 在印刷电路板中形成固体通孔的方法
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Application No.: US12043994Application Date: 2008-03-07
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Publication No.: US07987587B2Publication Date: 2011-08-02
- Inventor: Wiren Dale Becker , Michael Ford McAllister , Alan Daniel Stigliani , John G. Torok
- Applicant: Wiren Dale Becker , Michael Ford McAllister , Alan Daniel Stigliani , John G. Torok
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Dennis Jung
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10
Abstract:
A method is described by which an electrical path is created between layers on a printed circuit board (PCB) without the use of plated through holes (PTH). Through the use of a liquid solder or conductive epoxy injection fixture, a conductive path is created in pre-drilled holes forming an electrical connection between internal PCB metal layers and surface mounted components without the creation of parasitic stubs on the signal nets.
Public/Granted literature
- US20090223710A1 Method of Forming Solid Vias in a Printed Circuit Board Public/Granted day:2009-09-10
Information query
