Invention Grant
- Patent Title: Method for assembling a component
- Patent Title (中): 组件组装方法
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Application No.: US12341698Application Date: 2008-12-22
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Publication No.: US07974718B2Publication Date: 2011-07-05
- Inventor: Joachim Schweikle
- Applicant: Joachim Schweikle
- Applicant Address: DE Dettingen/Tech
- Assignee: Dietz-Automotive GmbH & Co., KG
- Current Assignee: Dietz-Automotive GmbH & Co., KG
- Current Assignee Address: DE Dettingen/Tech
- Agency: Venable LLP
- Agent Robert Kinberg; Ryan M. Flandro
- Priority: DE102007062376 20071222
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A method for assembling a component including individual parts, includes making a plurality of the individual parts available in a plurality of respective containers. A control and display unit is assigned to each respective container. Each control and display unit includes a display element and a sensor associated with each container. The display element is activated on a respective container to indicate the individual part required for a next assembly step. The individual part is removed from the container indicated by the display element. The removal of the individual part is monitored by the sensor of the control and display unit. The component is assembled inside an assembly device during individual assembly steps. The assembly device is monitored with a sensor arrangement to determine whether each individual part required for assembling the component is available.
Public/Granted literature
- US20090158577A1 METHOD FOR ASSEMBLING A COMPONENT Public/Granted day:2009-06-25
Information query