Invention Grant
- Patent Title: Integrated circuit carrier assembly
- Patent Title (中): 集成电路载体组件
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Application No.: US12140268Application Date: 2008-06-17
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Publication No.: US07974102B2Publication Date: 2011-07-05
- Inventor: Kia Silverbrook
- Applicant: Kia Silverbrook
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: H05K7/10
- IPC: H05K7/10

Abstract:
Provided is a carrier assembly for an integrated circuit. The assembly includes a printed circuit board (PCB), and a carrier fast with the PCB. The carrier has a matrix of island contacts interconnected by respective serpentine members to allow resilient deflection of such contacts relative to each other, the matrix surrounding a passage defined through the carrier. Also included is a retainer for operatively locating the integrated circuit within said passage so that the integrated circuit is electrically connected to the carrier.
Public/Granted literature
- US20080247144A1 INTEGRATED CIRCUIT CARRIER ASSEMBLY Public/Granted day:2008-10-09
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