Invention Grant
- Patent Title: Electro-magnetic bandgap structure
- Patent Title (中): 电磁带隙结构
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Application No.: US12437341Application Date: 2009-05-07
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Publication No.: US07973619B2Publication Date: 2011-07-05
- Inventor: Won-Woo Cho , Dek-Gin Yang , Bong-Wan Koo , Hyung-Ho Kim
- Applicant: Won-Woo Cho , Dek-Gin Yang , Bong-Wan Koo , Hyung-Ho Kim
- Applicant Address: KR Gyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0098617 20081008
- Main IPC: H01P1/203
- IPC: H01P1/203 ; H01P5/08

Abstract:
An electro-magnetic bandgap structure is disclosed. The electro-magnetic bandgap structure in accordance with an embodiment of the present invention includes a plurality of conductive plates bridge-connected with one another on a same plane, whereas the each of the conductive plates includes an internal patch; a first ring patch be electrically separated from the internal patch and surrounding the internal patch; and a second ring patch surrounding the first ring patch and electrically connected with the first ring patch through a portion.
Public/Granted literature
- US20100085128A1 ELECTRO-MAGNETIC BANDGAP STRUCTURE Public/Granted day:2010-04-08
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