Invention Grant
- Patent Title: Thermal monitoring and management of integrated circuits
- Patent Title (中): 集成电路的热监测和管理
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Application No.: US12194706Application Date: 2008-08-20
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Publication No.: US07973544B2Publication Date: 2011-07-05
- Inventor: Vance D. Archer, III , Daniel P. Chesire , Warren K. Gladden , Seung H. Kang , Taeho Kook , Sailesh M. Merchant , Vivian Ryan
- Applicant: Vance D. Archer, III , Daniel P. Chesire , Warren K. Gladden , Seung H. Kang , Taeho Kook , Sailesh M. Merchant , Vivian Ryan
- Applicant Address: US PA Allentown
- Assignee: Agere Systems Inc.
- Current Assignee: Agere Systems Inc.
- Current Assignee Address: US PA Allentown
- Main IPC: G01R31/00
- IPC: G01R31/00
Abstract:
The invention, in one aspect, provides a semiconductor device (100), including transistors (105), dielectric layers (115, 120) located over the transistors (105), interconnects (122) formed within the dielectric layers (115, 120), and a test structure (130) located adjacent a hot-spot (125) of the semiconductor device (100) and configured to monitor a real-time operational parameter of at least one of the transistors (105) or interconnects (122).
Public/Granted literature
- US20100045326A1 THERMAL MONITORING AND MANAGEMENT OF INTEGRATED CIRCUITS Public/Granted day:2010-02-25
Information query
