Invention Grant
- Patent Title: Three-dimensional stacked substrate arrangements
- Patent Title (中): 三维堆叠衬底布置
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Application No.: US12319035Application Date: 2008-12-31
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Publication No.: US07973407B2Publication Date: 2011-07-05
- Inventor: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
- Applicant: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44
Abstract:
Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
Public/Granted literature
- US20090174070A1 Three-dimensional stacked substrate arrangements Public/Granted day:2009-07-09
Information query
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