Invention Grant
US07973404B2 Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device
有权
在半导体器件中提供的继电器板，半导体器件和半导体器件的制造方法
- Patent Title: Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device
- Patent Title (中): 在半导体器件中提供的继电器板，半导体器件和半导体器件的制造方法
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Application No.: US11377393Application Date: 2006-03-17
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Publication No.: US07973404B2Publication Date: 2011-07-05
- Inventor: Takao Nishimura , Yoshiaki Narisawa , Yoshikazu Kumagaya
- Applicant: Takao Nishimura , Yoshiaki Narisawa , Yoshikazu Kumagaya
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2005-354986 20051208
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A relay board provided in a semiconductor device, including an entire main surface that is made of a conductive material. The relay board may further include a substrate made of the same material as at least one semiconductor element provided in the semiconductor device. The main surface of the relay board may be formed at an upper part of the substrate.
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Information query
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