Invention Grant
- Patent Title: IGBT semiconductor device
- Patent Title (中): IGBT半导体器件
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Application No.: US12741622Application Date: 2008-11-05
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Publication No.: US07973363B2Publication Date: 2011-07-05
- Inventor: Masafumi Hara
- Applicant: Masafumi Hara
- Applicant Address: JP Toyota-shi, Aichi-ken
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota-shi, Aichi-ken
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2007-289536 20071107
- International Application: PCT/JP2008/070109 WO 20081105
- International Announcement: WO2009/060852 WO 20090514
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L29/74

Abstract:
To provide a semiconductor device in which dielectric breakdown strength in a peripheral region is increased without increasing on-resistance. An IGBT comprises a body region, guard ring, and collector layer. The body region is formed within an active region in a surface layer of a drift layer. The guard ring is formed within a peripheral region in the surface layer of the drift layer, and surrounds the body region. The collector layer is formed at a back surface side of the drift layer, and is formed across the active region and the peripheral region. A distance F between a back surface of the guard ring and the back surface of the drift layer is greater than a distance between a back surface of the body region and the back surface of the drift layer. A thickness H of the collector layer in the peripheral region is smaller than a thickness D of the collector layer in the active region.
Public/Granted literature
- US20100224907A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-09-09
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