Invention Grant
- Patent Title: Semiconductor structure combination for epitaxy of semiconductor optoelectronic device
- Patent Title (中): 半导体光电子器件外延半导体结构组合
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Application No.: US11987640Application Date: 2007-12-03
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Publication No.: US07973326B2Publication Date: 2011-07-05
- Inventor: Chih-Ching Cheng , Tzong-Liang Tsai
- Applicant: Chih-Ching Cheng , Tzong-Liang Tsai
- Applicant Address: TW Taichung
- Assignee: HUGA Optotech Inc.
- Current Assignee: HUGA Optotech Inc.
- Current Assignee Address: TW Taichung
- Agency: Jianq Chyun IP Office
- Priority: TW96123799A 20070629
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
The invention discloses a semiconductor structure combination for the epitaxy of a semiconductor optoelectronic device and manufacture thereof. The semiconductor structure combination according to the invention includes a substrate and a semiconductor material. The substrate has an upper surface and a recess formed on the upper surface. The sidewalls of the recess provide a first site for the growth of a plurality of first epitaxial crystals of the semiconductor material toward a first preferred orientation. A bottom of the recess provides a second site for the growth of a second epitaxial crystal of the semiconductor material toward the first preferred orientation. Flat regions adjacent to the recess provide a third site for the growth of a third epitaxial crystal of the semiconductor material toward the first preferred orientation.
Public/Granted literature
- US20090001394A1 Semiconductor structure combination for epitaxy of semiconductor optoelectronic device Public/Granted day:2009-01-01
Information query
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