Invention Grant
- Patent Title: Substrate positioning device and substrate positioning method
- Patent Title (中): 基板定位装置及基板定位方法
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Application No.: US12771277Application Date: 2010-04-30
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Publication No.: US07973300B2Publication Date: 2011-07-05
- Inventor: Hiroyuki Takahashi , Chikara Tokida
- Applicant: Hiroyuki Takahashi , Chikara Tokida
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-022363 20070131
- Main IPC: G01N21/86
- IPC: G01N21/86 ; G01N21/00
Abstract:
It is intended to achieve a high level of positioning accuracy for a substrate assuming a two-layer structure constituted with a transparent layer with a high level of light transmissivity and a nontransparent layer with a low level of light transmissivity. A substrate positioning device according to the present invention characterized in that only the edge of the nontransparent layer, not the edge of the transparent layer, is exclusively detected and the substrate is positioned based upon the detection results.
Public/Granted literature
- US20100228371A1 SUBSTRATE POSITIONING DEVICE AND SUBSTRATE POSITIONING METHOD Public/Granted day:2010-09-09
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