Invention Grant
- Patent Title: Connecting portion of circuit board and circuit board-connecting structure technical field
- Patent Title (中): 电路板连接部分和电路板连接结构技术领域
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Application No.: US12161668Application Date: 2006-02-03
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Publication No.: US07973247B2Publication Date: 2011-07-05
- Inventor: Hidetsugu Mukae , Hiroyuki Suzuki
- Applicant: Hidetsugu Mukae , Hiroyuki Suzuki
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Seed IP Law Group PLLC
- International Application: PCT/JP2006/301851 WO 20060203
- International Announcement: WO2007/088631 WO 20070809
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
In a circuit board-connecting portion 10, a first connecting portion 15 and a second connecting portion 20 are disposed in facing relation such that first conductors 14 contact second conductors 19, and also a first substrate 12 and a second substrate 17 are fixed to each other by an adhesive 22. The first connecting portion 15 has rigid members 24 provided at a reverse surface 12B of the first substrate 12 which is a soft substrate, and the rigid members 24 are disposed along a direction of a thickness of the first substrate 14, and are provided at positions corresponding to at least parts 14A of the first conductors 14.
Public/Granted literature
- US20100220457A1 CONNECTING PORTION OF CIRCUIT BOARD AND CIRCUIT BOARD-CONNECTING STRUCTURE TECHNICAL FIELD Public/Granted day:2010-09-02
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