Invention Grant
- Patent Title: Wiring board and capacitor to be built into wiring board
- Patent Title (中): 接线板和电容器内置在接线板上
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Application No.: US12026838Application Date: 2008-02-06
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Publication No.: US07973245B2Publication Date: 2011-07-05
- Inventor: Masaki Muramatsu , Shinji Yuri , Kazuhiro Urashima , Hiroshi Yamamoto , Toshitake Seki , Motohiko Sato
- Applicant: Masaki Muramatsu , Shinji Yuri , Kazuhiro Urashima , Hiroshi Yamamoto , Toshitake Seki , Motohiko Sato
- Applicant Address: JP Nagoya, Aichi
- Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee Address: JP Nagoya, Aichi
- Agency: Stites & Harbison PLLC
- Agent Jeffrey A. Haeberlin; Stephen J. Weyer
- Priority: JP2005-033558 20050209; JP2005-033559 20050209; JP2005-203181 20050712
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area that overlaps an orthogonal projection of the sub-core portion. The latter incorporates a laminated ceramic capacitor formed by first and second conductor layers with a ceramic (dielectric) layer therebetween. The first layer is connected to first and second side terminals of a first type while the second layer is connected to first and second side terminals of a second type. The housing portion has an inner edge which, in cross section, is of a quadrate shape, and a radius portion is formed at each corner having a dimension of between 0.1 and 2 mm.
Public/Granted literature
- US20080223607A1 WIRING BOARD AND CAPACITOR TO BE BUILT INTO WIRING BOARD Public/Granted day:2008-09-18
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