Invention Grant
- Patent Title: Self aligned double patterning flow with non-sacrificial features
- Patent Title (中): 具有非牺牲特征的自对准双图案流
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Application No.: US12326068Application Date: 2008-12-01
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Publication No.: US07972959B2Publication Date: 2011-07-05
- Inventor: Bencherki Mebarki , Li Yan Miao , Kenlin C. Huang
- Applicant: Bencherki Mebarki , Li Yan Miao , Kenlin C. Huang
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
Embodiments of the present invention pertain to methods of forming features on a substrate using a self-aligned double patterning (SADP) process. A conformal layer of non-sacrificial material is formed over features of sacrificial structural material patterned near the optical resolution of a photolithography system using a high-resolution photomask. An anisotropic etch of the non-sacrificial layer leaves non-sacrificial ribs above a substrate. A gapfill layer deposited thereon may be etched or polished back to form alternating fill and non-sacrificial features. No hard mask is needed to form the non-sacrificial ribs, reducing the number of processing steps involved.
Public/Granted literature
- US20100136784A1 SELF ALIGNED DOUBLE PATTERNING FLOW WITH NON-SACRIFICIAL FEATURES Public/Granted day:2010-06-03
Information query
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