Invention Grant
- Patent Title: Manufacturing method of semiconductor device
- Patent Title (中): 半导体器件的制造方法
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Application No.: US12034677Application Date: 2008-02-21
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Publication No.: US07972943B2Publication Date: 2011-07-05
- Inventor: Tomoaki Moriwaka
- Applicant: Tomoaki Moriwaka
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2007-052230 20070302
- Main IPC: H01L21/36
- IPC: H01L21/36

Abstract:
A cap film is formed over semiconductor films formed over an insulating substrate; the semiconductor films are irradiated with a laser beam which is capable of completely melting the semiconductor film in a film-thickness direction to completely melt the semiconductor film. By controlling the laser beam, a crystalline semiconductor films are formed over the substrate, in each of which orientations of crystal planes are controlled. In addition, an n-channel thin film transistor is formed using a crystalline region in which crystal planes are oriented along {001} and a p-channel thin film transistor is formed using a crystalline region in which crystal planes are oriented along {211} or {101}.
Public/Granted literature
- US20080213984A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2008-09-04
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