Invention Grant
US07972914B2 Semiconductor device with FinFET and method of fabricating the same
有权
具有FinFET的半导体器件及其制造方法
- Patent Title: Semiconductor device with FinFET and method of fabricating the same
- Patent Title (中): 具有FinFET的半导体器件及其制造方法
-
Application No.: US12477348Application Date: 2009-06-03
-
Publication No.: US07972914B2Publication Date: 2011-07-05
- Inventor: Sung-min Kim , Min-sang Kim , Eun-jung Yun
- Applicant: Sung-min Kim , Min-sang Kim , Eun-jung Yun
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Mills & Onello, LLP
- Priority: KR10-2005-0030947 20050414
- Main IPC: H01L21/338
- IPC: H01L21/338 ; H01L21/336 ; H01L21/3205

Abstract:
A FinFET semiconductor device has an active region formed of a semiconductor substrate and projecting from a surface of the substrate. A fin having a first projection and a second projection composed of the active region are arranged in parallel and at each side of a central trench formed in a central portion of the active region. Upper surfaces and side surfaces of the first projection and the second projection comprise a channel region. A channel ion implantation layer is provided at a bottom of the central trench and at a lower portion of the fin. A gate oxide layer is provided on the fin. A gate electrode is provided on the gate oxide layer. A source region and a drain region are provided in the active region at sides of the gate electrode. A method of forming such a device is also provided.
Public/Granted literature
- US20090239346A1 SEMICONDUCTOR DEVICE WITH FINFET AND METHOD OF FABRICATING THE SAME Public/Granted day:2009-09-24
Information query
IPC分类: