Invention Grant
- Patent Title: Transparent conductive laminated body and transparent touch-sensitive panel
- Patent Title (中): 透明导电层压体和透明触摸屏
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Application No.: US11660600Application Date: 2005-08-18
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Publication No.: US07972684B2Publication Date: 2011-07-05
- Inventor: Hiroshi Hara , Haruhiko Itoh , Isao Shiroishi , Hitoshi Mikoshiba
- Applicant: Hiroshi Hara , Haruhiko Itoh , Isao Shiroishi , Hitoshi Mikoshiba
- Applicant Address: JP Osaka
- Assignee: Teijin Limited
- Current Assignee: Teijin Limited
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2004-240521 20040820; JP2004-286302 20040930; JP2004-293417 20041006; JP2005-152399 20050525
- International Application: PCT/JP2005/015381 WO 20050818
- International Announcement: WO2006/019184 WO 20060223
- Main IPC: B32B7/02
- IPC: B32B7/02
Abstract:
A transparent conductive laminated body (1) contains a polymer film having a metallic compound layer and a transparent conductive layer laminated sequentially on at least one surface thereof, (2) the metallic compound layer is in contact with the transparent conductive layer, and (3) the metallic compound layer has a thickness of 0.5 nm or more and less than 10.0 nm.
Public/Granted literature
- US20070224412A1 Transparent Conductive Laminated Body and Transparent Touch-Sensitive Panel Public/Granted day:2007-09-27
Information query
