Invention Grant
- Patent Title: Electrospraying method with conductivity control
- Patent Title (中): 电喷雾法电导率控制
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Application No.: US11906998Application Date: 2007-10-04
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Publication No.: US07972661B2Publication Date: 2011-07-05
- Inventor: David Y. H. Pui , Da-Ren Chen
- Applicant: David Y. H. Pui , Da-Ren Chen
- Applicant Address: US MN St. Paul
- Assignee: Regents of the University of Minnesota
- Current Assignee: Regents of the University of Minnesota
- Current Assignee Address: US MN St. Paul
- Agency: Mueting Raasch & Gebhardt, P.A.
- Main IPC: B05D1/06
- IPC: B05D1/06

Abstract:
An electrospraying apparatus and/or method is used to coat particles. For example, a flow including at least one liquid suspension may be provided through at least one opening at a spray dispenser end. The flow includes at least particles and a coating material. A spray of microdroplets suspending at least the particles is established forward of the spray dispenser end by creating a nonuniform electrical field between the spray dispenser end and an electrode electrically isolated therefrom. The particles are coated with at least a portion of the coating material as the microdroplet evaporates. For example, the suspension may include biological material particles.
Public/Granted literature
- US20080141936A1 Electrospraying apparatus and method for coating particles Public/Granted day:2008-06-19
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