A light emitting diode (LED) package includes a base, a body and several LED chips. The body having an end surface is disposed on the base. A peripheral recess is formed in the end surface. The LED chips are disposed on a bottom of the peripheral recess for providing sidelight of the LED package. The LED package is connectable to a light guide pipe including a column having an external circumferential surface and an internal reflection surface, and a plurality of prism structures disposed between or on at least one of the external circumferential surface and the internal reflection surface for scattering light received by the light guide pipe from the LED package.