Invention Grant
- Patent Title: Planar beam dump
- Patent Title (中): 平面射束
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Application No.: US12651344Application Date: 2009-12-31
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Publication No.: US07971465B2Publication Date: 2011-07-05
- Inventor: Lynne C. Eigler , Yan S. Tam
- Applicant: Lynne C. Eigler , Yan S. Tam
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Haynes & Boone, LLP.
- Main IPC: B21C25/08
- IPC: B21C25/08
Abstract:
In one embodiment, a device for capturing radiation includes: a panel defining a plurality of double wedge chambers, wherein each double wedge chamber includes a first wedge-shaped chamber that tapers into an opening for a second wedge-shaped chamber, and wherein a longitudinal axis of the first wedge-shaped chamber is not collinear with a longitudinal axis of the second wedge-shaped chamber.
Public/Granted literature
- US20100175454A1 PLANAR BEAM DUMP Public/Granted day:2010-07-15
Information query
