Invention Grant
- Patent Title: Pattern inspection method and apparatus
- Patent Title (中): 图案检验方法及装置
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Application No.: US11931856Application Date: 2007-10-31
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Publication No.: US07957579B2Publication Date: 2011-06-07
- Inventor: Takashi Hiroi , Masahiro Watanabe , Chie Shishido , Aritoshi Sugimoto , Maki Tanaka , Hiroshi Miyai , Asahiro Kuni , Yasuhiko Nara
- Applicant: Takashi Hiroi , Masahiro Watanabe , Chie Shishido , Aritoshi Sugimoto , Maki Tanaka , Hiroshi Miyai , Asahiro Kuni , Yasuhiko Nara
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2000-347443 20001109
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
An apparatus for processing a defect candidate image, including: a scanning electron microscope for taking an enlarged image of a specimen by irradiating and scanning a converged electron beam onto the specimen and detecting charged particles emanated from the specimen by the irradiation; an image processor for processing the image taken by the scanning electron microscope to detect defect candidates on the specimen and classify the detected defect candidates into one of plural classes; a memory for storing output from the image processor including images of the detected defect candidates; and a display unit which displays information stored in the memory and an indicator, wherein the display unit displays a distribution of the detected and classified defect candidates in a map format by distinguishing by the classified class, and the display unit also displays an image of a defect candidate stored in the memory together with the map which is indicated on the map by the indicator.
Public/Granted literature
- US20100246933A9 Pattern Inspection Method And Apparatus Public/Granted day:2010-09-30
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