Invention Grant
- Patent Title: Protective covering for an electronic device
- Patent Title (中): 电子设备防护罩
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Application No.: US11681665Application Date: 2007-03-02
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Publication No.: US07957524B2Publication Date: 2011-06-07
- Inventor: Phillip Chipping
- Applicant: Phillip Chipping
- Applicant Address: US UT Salt Lake City
- Assignee: Zagg Incorporated
- Current Assignee: Zagg Incorporated
- Current Assignee Address: US UT Salt Lake City
- Agency: Workman Nydegger
- Main IPC: H04M1/02
- IPC: H04M1/02
Abstract:
A protective cover for electronic devices. A device is examined and a film is prepared. The film may include multiple pieces and may have cutouts for discontinuities in the surfaces of the device or to accommodate a user interface. The corners or other portions of the films are then cut such that the films substantially cover the surface of the device without bunching or creating air pockets.
Public/Granted literature
- US20090086415A1 PROTECTIVE COVERING FOR AN ELECTRONIC DEVICE Public/Granted day:2009-04-02
Information query
