Invention Grant
- Patent Title: Method and apparatus for high-performance bonding resequencing
- Patent Title (中): 用于高性能接合重新测序的方法和装置
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Application No.: US12829545Application Date: 2010-07-02
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Publication No.: US07957392B2Publication Date: 2011-06-07
- Inventor: David Pullen , Niki Pantelias , Dannie Gay
- Applicant: David Pullen , Niki Pantelias , Dannie Gay
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H04L12/28
- IPC: H04L12/28

Abstract:
A method, system, and computer program product for receiving and resequencing a plurality of data segments received on a plurality of channels of a bonding channel set, comprising deter mining if a sequence number of a received segment matches an expected sequence number. If so, the process includes forwarding the segment for further processing, incrementing the expected sequence number; and forwarding any queued packets corresponding to the expected sequence number and immediately succeeding sequence numbers less than a sequence number of annexed missing segment. If the sequence number of the received segment does not match the expected sequence number, the received segment is queued at a memory location. The address of this location is converted to a segment index. The segment index is stored in a sparse array.
Public/Granted literature
- US20100265954A1 Method, System, and Computer Program Product for High-Performance Bonding Resequencing Public/Granted day:2010-10-21
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