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US07957155B2 System for attaching a substantially three-dimensional structure to a substantially two-dimensional structure 失效
用于将基本上三维结构附接到基本上二维结构的系统

  • Patent Title: System for attaching a substantially three-dimensional structure to a substantially two-dimensional structure
  • Patent Title (中): 用于将基本上三维结构附接到基本上二维结构的系统
  • Application No.: US11377818
    Application Date: 2006-03-15
  • Publication No.: US07957155B2
    Publication Date: 2011-06-07
  • Inventor: Harold B. Kent , Steven T. Kent
  • Applicant: Harold B. Kent , Steven T. Kent
  • Applicant Address: US CA Santa Clara
  • Assignee: Medconx, Inc.
  • Current Assignee: Medconx, Inc.
  • Current Assignee Address: US CA Santa Clara
  • Agency: Jones Day
  • Main IPC: H05K7/06
  • IPC: H05K7/06
System for attaching a substantially three-dimensional structure to a substantially two-dimensional structure
Abstract:
A method and system for transporting a fluid, gas, semi-solid, cryogen, or particulate matter, or combination thereof, between a three-dimensional structure and a substantially two-dimensional structure is disclosed. A system and method for electrically coupling a three-dimensional structure to a substantially two dimensional structure is also disclosed.
Abstract(Chinese):

公开了一种用于在三维结构和基本上二维结构之间输送流体，气体，半固体，低温或颗粒物质或其组合的方法和系统。 还公开了一种将三维结构电耦合到基本二维结构的系统和方法。

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