Invention Grant
US07957137B2 Method for cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
有权
用于在微通道中冷却具有冷却剂流的集成电路管芯和在微通道中的薄膜热电冷却装置的方法
- Patent Title: Method for cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
- Patent Title (中): 用于在微通道中冷却具有冷却剂流的集成电路管芯和在微通道中的薄膜热电冷却装置的方法
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Application No.: US12610713Application Date: 2009-11-02
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Publication No.: US07957137B2Publication Date: 2011-06-07
- Inventor: Ravi Prasher
- Applicant: Ravi Prasher
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Buckley, Maschoff & Talwalkar LLC
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A method includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The method also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The method further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.
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