Invention Grant
- Patent Title: Method and apparatus for providing thermal management in an electronic device
- Patent Title (中): 在电子设备中提供热管理的方法和装置
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Application No.: US12129246Application Date: 2008-05-29
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Publication No.: US07957133B2Publication Date: 2011-06-07
- Inventor: Christopher E. Zieman , Todd Mason
- Applicant: Christopher E. Zieman , Todd Mason
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: BainwoodHuang
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20

Abstract:
An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system.
Public/Granted literature
- US20080225479A1 METHOD AND APPARATUS FOR PROVIDING THERMAL MANAGEMENT IN AN ELECTRONIC DEVICE Public/Granted day:2008-09-18
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