Invention Grant
- Patent Title: Assembly and electronic apparatus
- Patent Title (中): 装配和电子设备
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Application No.: US12379547Application Date: 2009-02-24
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Publication No.: US07957125B2Publication Date: 2011-06-07
- Inventor: Masaki Iwata
- Applicant: Masaki Iwata
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2008-168992 20080627
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00
Abstract:
An assembly includes a first housing, a second housing that houses a plate member, and a connecting section that connects the first housing to the second housing in such a way that the first housing is openable and closable with respect to the second housing on one side of the second housing. The connecting section includes a first fastening section fastened to the plate member.
Public/Granted literature
- US20090323269A1 Assembly and electronic apparatus Public/Granted day:2009-12-31
Information query
