Invention Grant
- Patent Title: Capacitor chip and method for manufacturing same
- Patent Title (中): 电容器芯片及其制造方法
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Application No.: US12097338Application Date: 2006-12-14
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Publication No.: US07957120B2Publication Date: 2011-06-07
- Inventor: Kenki Kobayashi , Eiji Komazawa , Tomoya Utashiro
- Applicant: Kenki Kobayashi , Eiji Komazawa , Tomoya Utashiro
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-361966 20051215
- International Application: PCT/JP2006/324901 WO 20061214
- International Announcement: WO2007/069670 WO 20070621
- Main IPC: H01G9/042
- IPC: H01G9/042

Abstract:
The present invention relates to a capacitor chip and a solid electrolytic capacitor, wherein in a capacitor chip in which one or more capacitor element is laminated on a metal lead frame to carry electricity and the whole is encapsulated with resin, a laminated body is located within a certain definite range. The present invention enables to increase the capacitance of a capacitor by broadening the allowable range of the total thickness of the laminated capacitor chips without generating defective appearance of the laminated solid electrolytic capacitor.
Public/Granted literature
- US20090290292A1 CAPACITOR CHIP AND METHOD FOR MANUFACTURING SAME Public/Granted day:2009-11-26
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