Invention Grant
- Patent Title: Wide-band antenna and manufacturing method thereof
- Patent Title (中): 宽带天线及其制造方法
-
Application No.: US12469221Application Date: 2009-05-20
-
Publication No.: US07956812B2Publication Date: 2011-06-07
- Inventor: Yean-Cheng Chen , Chih-Ming Wang , Kuan-Hsueh Tseng
- Applicant: Yean-Cheng Chen , Chih-Ming Wang , Kuan-Hsueh Tseng
- Applicant Address: TW Taipei
- Assignee: Winstron Neweb Corp.
- Current Assignee: Winstron Neweb Corp.
- Current Assignee Address: TW Taipei
- Agency: Thomas, Kayden, Horstemeyer & Risley, LLP
- Priority: TW97130719A 20080812; TW97141360A 20081028
- Main IPC: H01Q1/38
- IPC: H01Q1/38

Abstract:
A wide-band antenna and a manufacturing method thereof are provided. The wide-band antenna includes a substrate, a first radiator, a second radiator, a grounding portion, and a signal feeding portion. The first radiator is disposed on a first surface of the substrate while the second radiator is disposed on the first surface or a second surface opposite to the first surface. The first radiator and the second radiator are spaced apart by a predetermined distance. The grounding portion is disposed on the substrate to couple with the second radiator. The signal feeding portion has a coupling unit disposed on the second surface and at least partially overlapping the first radiator. The signal feeding portion is coupled with the grounding portion and feeds signals to excite the first radiator to form a first band mode through coupling effect by the coupling unit. The first radiator feeds signals to excite the second radiator to form a second band mode by coupling effect.
Public/Granted literature
- US20100039329A1 Wide-Band Antenna and Manufacturing Method Thereof Public/Granted day:2010-02-18
Information query