Invention Grant
- Patent Title: Ultrasonic sensor and method for manufacturing the same
- Patent Title (中): 超声波传感器及其制造方法
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Application No.: US12189854Application Date: 2008-08-12
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Publication No.: US07956516B2Publication Date: 2011-06-07
- Inventor: Seigo Hayashi , Masanaga Nishikawa
- Applicant: Seigo Hayashi , Masanaga Nishikawa
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2006-036219 20060214
- Main IPC: H01L41/053
- IPC: H01L41/053

Abstract:
An ultrasonic sensor includes a cylindrical casing having a bottom portion. The casing has a piezoelectric element on a bottom surface thereof. A substrate is attached to an end surface of an opening portion of the casing with a damping member provided therebetween such that the damping member covers the opening portion. Pin terminals are arranged so as to extend through the substrate and the damping member and are electrically connected to the piezoelectric element with lead wires. An inner space of the casing is filled with foamable resin.
Public/Granted literature
- US20080290758A1 ULTRASONIC SENSOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2008-11-27
Information query
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