Invention Grant
- Patent Title: Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device
- Patent Title (中): 半导体芯片及其制造方法，半导体芯片的电极结构及其形成方法以及半导体器件
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Application No.: US11794243Application Date: 2005-12-27
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Publication No.: US07956460B2Publication Date: 2011-06-07
- Inventor: Goro Nakatani
- Applicant: Goro Nakatani
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, PC
- Priority: JP2004-381363 20041228; JP2005-129000 20050427
- International Application: PCT/JP2005/023911 WO 20051227
- International Announcement: WO2006/070808 WO 20060706
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/48
Abstract:
A semiconductor chip according to the present invention includes a semiconductor substrate, a bump of a metal projecting from a surface of the semiconductor substrate, and an alloy film covering the entire surface of the bump, the alloy film being composed of an alloy of the metal of the bump and a second metal.
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