Invention Grant
US07956457B2 System and apparatus for venting electronic packages and method of making same
有权
用于排放电子封装的系统和设备及其制造方法
- Patent Title: System and apparatus for venting electronic packages and method of making same
- Patent Title (中): 用于排放电子封装的系统和设备及其制造方法
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Application No.: US12326202Application Date: 2008-12-02
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Publication No.: US07956457B2Publication Date: 2011-06-07
- Inventor: Raymond Albert Fillion , Kevin M. Durocher , Elizabeth A. Burke , Thomas Bert Gorczyca , Charles G. Woychik
- Applicant: Raymond Albert Fillion , Kevin M. Durocher , Elizabeth A. Burke , Thomas Bert Gorczyca , Charles G. Woychik
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Ziolkowski Patent Solutions Group, SC
- Agent Jean K. Testa
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
An apparatus and method, the apparatus includes a substrate configured to support a plurality of dielectric layers, a device coupling area positioned in the substrate, and a plurality of gas exit apertures formed through the substrate. The plurality of gas exit apertures is configured to provide venting of at least one of moisture and outgassed material and the device coupling area is configured to receive an electronic device coupleable to the plurality of dielectric layers.
Public/Granted literature
- US20100133683A1 SYSTEM AND APPARATUS FOR VENTING ELECTRONIC PACKAGES AND METHOD OF MAKING SAME Public/Granted day:2010-06-03
Information query
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