Invention Grant
- Patent Title: Integrated capacitor with interlinked lateral fins
- Patent Title (中): 具有互连横向鳍片的集成电容器
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Application No.: US12276292Application Date: 2008-11-21
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Publication No.: US07956438B2Publication Date: 2011-06-07
- Inventor: Patrick J. Quinn
- Applicant: Patrick J. Quinn
- Applicant Address: US CA San Jose
- Assignee: Xilinx, Inc.
- Current Assignee: Xilinx, Inc.
- Current Assignee Address: US CA San Jose
- Agent Scott Hewett
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
A capacitor in an integrated circuit (“IC”) has a first node conductor formed in a first metal layer of the IC with a first spine extending along a first direction, a first vertical element extending from the first spine along a second direction perpendicular to the first direction. A first capital element extends along the first direction, and a first serif element extends from the capital element. The capacitor also has a second node conductor having a second spine, a second vertical element extending from the second spine toward the first spine, a second capital element, and a second serif element extending from the second capital between the first vertical element and the first serif element.
Public/Granted literature
- US20100127351A1 INTEGRATED CAPACITOR WITH INTERLINKED LATERAL FINS Public/Granted day:2010-05-27
Information query
IPC分类: