Invention Grant
- Patent Title: Wafer holding tool for ion implanting apparatus
- Patent Title (中): 用于离子注入装置的晶片固定工具
-
Application No.: US12501311Application Date: 2009-07-10
-
Publication No.: US07956335B2Publication Date: 2011-06-07
- Inventor: Yoshiro Aoki
- Applicant: Yoshiro Aoki
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Sumco Corporation
- Current Assignee: Sumco Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Priority: JP2008-181106 20080711
- Main IPC: G01J1/00
- IPC: G01J1/00

Abstract:
A wafer holding assembly is provided that is capable of preventing the temperature difference generated between a wafer and a holding pin through beam irradiation.In one embodiment, the wafer holding assembly has a plurality of holding pins for holding a wafer in the ion implanting apparatus, the holding pin comprises a head contacting with an end face of the wafer to control motion of the wafer and a flange projecting from the head to place the wafer, and the head is provided with a canopy portion extending in a direction different from a side placing the wafer.
Public/Granted literature
- US20100012856A1 WAFER HOLDING TOOL FOR ION IMPLANTING APPARATUS Public/Granted day:2010-01-21
Information query