Invention Grant
- Patent Title: Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium
- Patent Title (中): 热固性硅氧烷弹性体，导热硅橡胶组合物和导热介质
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Application No.: US11574345Application Date: 2005-08-29
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Publication No.: US07956121B2Publication Date: 2011-06-07
- Inventor: Kazuhiro Sekiba
- Applicant: Kazuhiro Sekiba
- Applicant Address: JP Tokyo
- Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2004-251098 20040830; JP2005-238279 20050819
- International Application: PCT/JP2005/016170 WO 20050829
- International Announcement: WO2006/025552 WO 20060309
- Main IPC: C08L83/04
- IPC: C08L83/04 ; C08K5/5415
Abstract:
A thermoconductive silicone elastomer comprising a silicone elastomer being a cured body of a hydrosilation-curable organopolysiloxane composition, a reinforcement fine silica powder, a thermoconductive inorganic powder, and an alkylphenylpolysiloxane that is liquid at room temperature. A hydrosilation-curable thermoconductive silicone elastomer composition comprising: a hydrosilation-curable organopolysiloxane composition, a reinforcement fine silica powder, a thermoconductive inorganic powder, and an alkylphenylpolysiloxane that is liquid at room temperature. A thermoconductive medium comprising the aforementioned thermoconductive silicone elastomer.
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