Invention Grant
- Patent Title: Ink composition and metallic material
- Patent Title (中): 墨水组成和金属材料
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Application No.: US11871446Application Date: 2007-10-12
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Publication No.: US07956103B2Publication Date: 2011-06-07
- Inventor: Hideyuki Hirakoso , Keisuke Abe , Yasuhiro Sanada
- Applicant: Hideyuki Hirakoso , Keisuke Abe , Yasuhiro Sanada
- Applicant Address: JP Tokyo
- Assignee: Asahi Glass Company, Limited
- Current Assignee: Asahi Glass Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-114700 20050412
- Main IPC: C09D11/00
- IPC: C09D11/00

Abstract:
To provide an ink composition capable of forming a metallic material which is excellent in adhesion to a substrate and free from ion migration. An ink composition having fine metallic copper particles and/or fine copper hydride particles, and fine silver oxide particles or fine metallic silver particles, dispersed in a water-insoluble organic liquid, which composition has a solid content concentration of from 10 to 80 mass % and contains from 5 to 90 parts by mass of the fine metallic copper particles and/or fine copper hydride particles, and from 10 to 95 parts by mass of the fine silver oxide particles or fine metallic silver particles, per 100 parts by mass of the total solid content in the ink composition.
Public/Granted literature
- US20080260995A1 INK COMPOSITION AND METALLIC MATERIAL Public/Granted day:2008-10-23
Information query
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