Invention Grant
- Patent Title: Injection molded solder ball method
- Patent Title (中): 注塑焊球法
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Application No.: US12543811Application Date: 2009-08-19
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Publication No.: US07955966B2Publication Date: 2011-06-07
- Inventor: Peter A. Gruber , Barry A. Hochlowski , David T. Naugle
- Applicant: Peter A. Gruber , Barry A. Hochlowski , David T. Naugle
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Connolly Bove Lodge & Hutz LLP
- Agent Vazken Alexanian
- Main IPC: H01L23/498
- IPC: H01L23/498
Abstract:
Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
Public/Granted literature
- US20090309219A1 INJECTION MOLDED SOLDER BALL METHOD Public/Granted day:2009-12-17
Information query
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