Invention Grant
- Patent Title: Dry etching method for semiconductor device
- Patent Title (中): 半导体器件的干蚀刻方法
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Application No.: US10798482Application Date: 2004-03-12
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Publication No.: US07955963B2Publication Date: 2011-06-07
- Inventor: Akira Takahashi
- Applicant: Akira Takahashi
- Applicant Address: JP Tokyo
- Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rabin & Berdo, P.C.
- Priority: JP2003-334784 20030926
- Main IPC: H01L21/3205
- IPC: H01L21/3205

Abstract:
The present invention provides a device having an N type polysilicon gate and a P type polysilicon gate disposed therein, wherein when both gates are simultaneously etched, they are disposed in such a manner that the area of a non-doped polysilicon gate corresponding to a dummy electrode becomes larger than the total area of the N type and P type doped polysilicon gates, thereby causing non-doped polysilicon to become dominant over doped polysilicon, whereby the polysilicon gates are dry-etched.
Public/Granted literature
- US20050067658A1 Dry etching method for semiconductor device Public/Granted day:2005-03-31
Information query
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