Invention Grant
- Patent Title: Coated thermal interface in integrated circuit die
- Patent Title (中): 集成电路芯片中的涂层热界面
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Application No.: US11278337Application Date: 2006-03-31
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Publication No.: US07955900B2Publication Date: 2011-06-07
- Inventor: Susheel G. Jadhav , Carl Deppisch
- Applicant: Susheel G. Jadhav , Carl Deppisch
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent John N. Greaves
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Some embodiments of the invention include a coated thermal interface to bond a die with a heat spreader. The coated thermal interface may be used to bond the die with the heat spreader without flux. Other embodiments are described and claimed.
Public/Granted literature
- US20070231967A1 COATED THERMAL INTERFACE IN INTEGRATED CIRCUIT DIE Public/Granted day:2007-10-04
Information query
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