Invention Grant
- Patent Title: Lamination for printed photomask
- Patent Title (中): 打印光掩模层压
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Application No.: US11938195Application Date: 2007-11-09
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Publication No.: US07955783B2Publication Date: 2011-06-07
- Inventor: Eric Shrader , Uma Srinivasan , Clark Crawford , Scott Limb
- Applicant: Eric Shrader , Uma Srinivasan , Clark Crawford , Scott Limb
- Applicant Address: US CA Palo Alto
- Assignee: Palo Alto Research Center Incorporated
- Current Assignee: Palo Alto Research Center Incorporated
- Current Assignee Address: US CA Palo Alto
- Agent Jonathan A. Small
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/16 ; G03F7/26 ; G03F7/40
Abstract:
A method for masking regions of photoresist in the manufacture of a soldermask for printed circuit boards is disclosed. Following application of photoresist over patterned traces on a substrate, a sheet-like thin film is applied over the photosensitive material. The thin film may adhere to the photosensitive material by way of the adhesive state of the photosensitive material or by way of an adhesive applied to the photosensitive material or the thin film or carried by the thin film. Digital mask printing may proceed on the surface of the thin film. The photosensitive material may then be exposed through the printed photomask, the thin film (with photomask) removed, and the photosensitive material developed.
Public/Granted literature
- US20090123873A1 Lamination for Printed Photomask Public/Granted day:2009-05-14
Information query
