A connection base assembly for an IC testing apparatus has a base, a top cap and a conductive assembly. The base has a bottom board and an outer frame provided with multiple grooves. The grooves are defined in the top of and extend to the bottom of the outer frame to form multiple through holes in the bottom of the outer frame. The conductive assembly is mounted between the base and the top cap and has multiple conductive elements, multiple top resilient elements and multiple bottom resilient elements. The conductive elements are mounted respectively in the grooves in the outer frame of the base, and each conductive element has a contacting segment and a connecting segment. The top resilient elements and the bottom resilient elements are respectively mounted on and abut with the tops and the bottoms of the conductive elements.