Invention Grant
- Patent Title: Method for processing substrates
- Patent Title (中): 处理基板的方法
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Application No.: US11900650Application Date: 2007-09-12
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Publication No.: US07955044B2Publication Date: 2011-06-07
- Inventor: Susumu Moriya , Yoshiteru Ikehata
- Applicant: Susumu Moriya , Yoshiteru Ikehata
- Applicant Address: JP Osaka
- Assignee: Daifuku Co., Ltd.
- Current Assignee: Daifuku Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: The Webb Law Firm
- Priority: JP2006-248171 20060913
- Main IPC: B65H1/00
- IPC: B65H1/00

Abstract:
A method for processing substrates for a substrate processing facility includes the steps of: performing ventilation of a container with a fan filter unit while a lid of the container is in a closed state, when the container is stored in a storage shelf, and when the container is transferred with a substrate transfer device, and ventilating the container with the fan filter with the lid of the container in an open state, when substrates are transferred in a substrate loading/unloading section with the substrate transfer device.
Public/Granted literature
- US20080089765A1 Method for processing substrates Public/Granted day:2008-04-17
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