Invention Grant
- Patent Title: Tape sticking apparatus and sticking method
- Patent Title (中): 贴纸装置和贴纸方法
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Application No.: US12093571Application Date: 2006-12-04
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Publication No.: US07954534B2Publication Date: 2011-06-07
- Inventor: Takahisa Yoshioka , Yoshiaki Sugishita
- Applicant: Takahisa Yoshioka , Yoshiaki Sugishita
- Applicant Address: JP Tokyo
- Assignee: Lintec Corporation
- Current Assignee: Lintec Corporation
- Current Assignee Address: JP Tokyo
- Agency: Lowe Hauptman Ham & Berner, LLP
- Priority: JP2005-355918 20051209
- International Application: PCT/JP2006/324161 WO 20061204
- International Announcement: WO2007/066610 WO 20070614
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B32B38/10 ; B29C65/00

Abstract:
A tape sticking apparatus includes a feed-out device for feeding out a raw sheet in which a strip-shaped tape base material is temporarily stuck on one surface of a strip-shaped release liner. A cutting device is configured to form a closed-loop-shaped cut-line on the tape base material to form a sticking tape. The apparatus further includes a peeling device for peeling the sticking tape from the release liner, and a sticking device for sticking the sticking tape to a workpiece. A collecting device collects the raw sheet after being peeled off the sticking tape by the peeling device.
Public/Granted literature
- US20090165958A1 TAPE STICKING APPARATUS AND STICKING METHOD Public/Granted day:2009-07-02
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