Invention Grant
- Patent Title: Method for manufacturing heat pipe and capillary structure thereon
- Patent Title (中): 在其上制造热管和毛细结构的方法
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Application No.: US11735906Application Date: 2007-04-16
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Publication No.: US07954237B2Publication Date: 2011-06-07
- Inventor: Kuo-Chang Cheng
- Applicant: Kuo-Chang Cheng
- Applicant Address: TW New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW New Taipei
- Agency: J.C. Patents
- Priority: TW96107325A 20070303
- Main IPC: F28D15/00
- IPC: F28D15/00

Abstract:
A method for manufacturing a heat pipe and a capillary structure thereon is provided, and the steps of the method are as follows. A hollow pipe which has an open end and a closed end is provided. A mold is placed into the hollow pipe through the open end. The mold includes a central rod and a shaping component mating with the central rod, and the shaping component has an outward shaping surface. A powder is filled into the space between the hollow pipe and the mold through the open end and then sintered to form a capillary structure on the inner wall of the hollow pipe, in which the capillary structure has a profile corresponding to the shaping surface of the shaping component. Thereafter, the central rod and the shaping component are sequentially taken out of the hollow pipe.
Public/Granted literature
- US20080216318A1 METHOD FOR MANUFACTURING HEAT PIPE AND CAPILLARY STRUCTURE THEREON Public/Granted day:2008-09-11
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