Invention Grant
US07954237B2 Method for manufacturing heat pipe and capillary structure thereon 有权
在其上制造热管和毛细结构的方法

  • Patent Title: Method for manufacturing heat pipe and capillary structure thereon
  • Patent Title (中): 在其上制造热管和毛细结构的方法
  • Application No.: US11735906
    Application Date: 2007-04-16
  • Publication No.: US07954237B2
    Publication Date: 2011-06-07
  • Inventor: Kuo-Chang Cheng
  • Applicant: Kuo-Chang Cheng
  • Applicant Address: TW New Taipei
  • Assignee: Wistron Corporation
  • Current Assignee: Wistron Corporation
  • Current Assignee Address: TW New Taipei
  • Agency: J.C. Patents
  • Priority: TW96107325A 20070303
  • Main IPC: F28D15/00
  • IPC: F28D15/00
Method for manufacturing heat pipe and capillary structure thereon
Abstract:
A method for manufacturing a heat pipe and a capillary structure thereon is provided, and the steps of the method are as follows. A hollow pipe which has an open end and a closed end is provided. A mold is placed into the hollow pipe through the open end. The mold includes a central rod and a shaping component mating with the central rod, and the shaping component has an outward shaping surface. A powder is filled into the space between the hollow pipe and the mold through the open end and then sintered to form a capillary structure on the inner wall of the hollow pipe, in which the capillary structure has a profile corresponding to the shaping surface of the shaping component. Thereafter, the central rod and the shaping component are sequentially taken out of the hollow pipe.
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