Invention Grant
- Patent Title: Method for component mounting
- Patent Title (中): 元件安装方法
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Application No.: US12513556Application Date: 2007-11-02
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Publication No.: US07954233B2Publication Date: 2011-06-07
- Inventor: Yasuhiro Maenishi
- Applicant: Yasuhiro Maenishi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2006-304389 20061109
- International Application: PCT/JP2007/071748 WO 20071102
- International Announcement: WO2008/056754 WO 20080515
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
A method for component mounting which reduces the length of time that a component mounter called alternate mounting component mounter takes for mounting components is a method for component mounting used for a component mounter including plural mounting heads which alternately mount components onto a board. The method includes specifying, as a first mounting head, one of the plural mounting heads which moves a shortest distance to the board (S2), and mounting the components onto the board which is brought into the component mounter, the mounting starting from the first mounting head (S14).
Public/Granted literature
- US20100064511A1 METHOD FOR COMPONENT MOUNTING Public/Granted day:2010-03-18
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