Invention Grant
- Patent Title: Electromagnetic mechanical pulse forming of fluid joints for high-pressure applications
- Patent Title (中): 用于高压应用的流体接头的电磁机械脉冲形成
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Application No.: US12124944Application Date: 2008-05-21
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Publication No.: US07954221B2Publication Date: 2011-06-07
- Inventor: Pradip K Saha , Don E Norris , Mark E Bice , Vaughn L Brady
- Applicant: Pradip K Saha , Don E Norris , Mark E Bice , Vaughn L Brady
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Ostrager Chong Flaherty & Broitman P.C.
- Main IPC: B21D39/00
- IPC: B21D39/00 ; B21D26/14 ; B23P17/00
Abstract:
An electromagnetically formed fluid circuit joint (150) includes a tubular conduit (58) that has an outer surface (154) with a groove (72). A hollow fitting (56) is mechanically separate from and received over the tubular conduit (58). The hollow fitting (56) includes an electromagnetic field formed wall deformation (165) that extends into the groove (72).
Public/Granted literature
- US20080240850A1 ELECTROMAGNETIC MECHANICAL PULSE FORMING OF FLUID JOINTS FOR HIGH-PRESSURE APPLICATIONS Public/Granted day:2008-10-02
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