Invention Grant
- Patent Title: Distributed simultaneous simulation
- Patent Title (中): 分布式同步仿真
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Application No.: US11747664Application Date: 2007-05-11
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Publication No.: US07949510B2Publication Date: 2011-05-24
- Inventor: Chi-Ho Cha , Hoon-Sang Jin , Hyun-Uk Jung
- Applicant: Chi-Ho Cha , Hoon-Sang Jin , Hyun-Uk Jung
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2006-0043082 20060512
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method and system for distributed simultaneous simulation are provided, the method including providing a state of at least one storage unit, providing a segment of the circuit bounded by the at least one storage unit, and simulating the segment in accordance with the state of the at least one storage unit; and the system including a memory for describing storage units of a circuit, maintaining states of the storage units, and identifying distributed segments comprising combinational logic separated by the storage units, and processing units, each for simultaneously simulating at least one of the segments in accordance with the maintained states.
Public/Granted literature
- US20070266355A1 DISTRIBUTED SIMULTANEOUS SIMULATION Public/Granted day:2007-11-15
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