Invention Grant
- Patent Title: Integrated circuit package system with lead locking structure
- Patent Title (中): 具有引线锁定结构的集成电路封装系统
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Application No.: US11964501Application Date: 2007-12-26
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Publication No.: US07948066B2Publication Date: 2011-05-24
- Inventor: Byung Tai Do , Heap Hoe Kuan , Linda Pei Ee Chua
- Applicant: Byung Tai Do , Heap Hoe Kuan , Linda Pei Ee Chua
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/44
Abstract:
A mountable integrated circuit package system includes: providing a base; depositing a photoresist on the base; patterning the photoresist with an opening; filling the opening with a metal; depositing a further metal on the metal to form a lead pad; removing the photoresist; attaching a die over the base; bonding wires between the die and the lead pad; encapsulating the die and the lead pad in an encapsulation formed into a lead pad lock adjacent the lead pad; and removing the base.
Public/Granted literature
- US20090166823A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD LOCKING STRUCTURE Public/Granted day:2009-07-02
Information query
IPC分类:
