Invention Grant
US07948043B2 MEMS package that includes MEMS device wafer bonded to cap wafer and exposed array pads
有权
MEMS封装，其包括结合到盖晶片和暴露的阵列焊盘的MEMS器件晶片
- Patent Title: MEMS package that includes MEMS device wafer bonded to cap wafer and exposed array pads
- Patent Title (中): MEMS封装，其包括结合到盖晶片和暴露的阵列焊盘的MEMS器件晶片
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Application No.: US12564139Application Date: 2009-09-22
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Publication No.: US07948043B2Publication Date: 2011-05-24
- Inventor: Dong-Joon Kim , Sung-Gyu Pyo
- Applicant: Dong-Joon Kim , Sung-Gyu Pyo
- Applicant Address: KR Chungcheongbuk-do
- Assignee: MagnaChip Semiconductor Ltd.
- Current Assignee: MagnaChip Semiconductor Ltd.
- Current Assignee Address: KR Chungcheongbuk-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR2006-0053623 20060614
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
A package of a micro-electro-mechanical systems (MEMS) device includes a cap wafer, a plurality of bonding bumps formed over the cap wafer, a plurality of array pads arrayed on an outer side of the bonding bumps, and an MEMS device wafer bonded to an upper portion of the cap wafer in a manner to expose the array pads.
Public/Granted literature
- US20100006959A1 PACKAGE OF MEMS DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2010-01-14
Information query
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